GB/T 32280-2015

Abolished

Test method for warp of silicon wafers—Automated non-contact scanning method

硅片翘曲度测试自动非接触扫描法

Standard Type

GBT

ICS

77.040

CCS

H21

Status

Abolished

Issue Date

2015-12-10

Implementation

2017-01-01

Centralized Committee

国家标准委

Issuing Authority

中华人民共和国国家质量监督检验检疫总局、中国国家标准化管理委员会

Application Summary AI generated

This standard specifies an automated non-contact scanning method for measuring the warp of silicon wafers, which is the deviation of the wafer's median surface from a reference plane. It is applied in the semiconductor manufacturing industry for quality control and process monitoring of polished or epitaxial silicon wafers used in integrated circuit fabrication. The method ensures accurate, repeatable warp measurements without physically contacting the wafer surface, preventing damage during testing.

Related Standards

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Transparency note: The application summary and key sentences on this page were automatically generated by AI from the standard's original text. This content has not been human-verified and should not be used for compliance or regulatory purposes. Always refer to the official standard document from the issuing authority.